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Self-catalytic pyrolysis thermodynamics of waste printed circuit boards with co-existing metals

Frontiers of Environmental Science & Engineering 2022, Volume 16, Issue 11, doi: 10.1007/s11783-022-1581-0

Abstract:

● The co-existing metals in WPCBs has positive catalytic influence in pyrolysis.

Keywords： Waste printed circuit board     Catalyst     Pyrolysis     Kinetics    

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Non-toxic, high selectivity process for the extraction of precious metals from waste printed circuitboards

Frontiers of Environmental Science & Engineering 2023, Volume 17, Issue 10, doi: 10.1007/s11783-023-1723-z

Abstract:

● Au, Ag and Pd were recovered from WPCBs with high efficiencies.

Keywords： Thiosulfate     Printed circuit boards     Precious metals     Leaching     Hydrometallurgy    

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Copper fractal growth during recycling from waste printed circuit boards by slurry electrolysis

Frontiers of Environmental Science & Engineering 2021, Volume 15, Issue 6, doi: 10.1007/s11783-021-1405-7

Abstract:

• Copper fractal growth was observed during WPCBs recycling by slurry electrolysis.

Keywords： Dendritic copper     Fractal growth     WPCBs     Slurry electrolysis    

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Copper recovery from waste printed circuit boards concentrated metal scraps by electrolysis

Xiaonan Liu, Qiuxia Tan, Yungui Li, Zhonghui Xu, Mengjun Chen

Frontiers of Environmental Science & Engineering 2017, Volume 11, Issue 5, doi: 10.1007/s11783-017-0997-4

Abstract: Copper recovery is the core of waste printed circuit boards (WPCBs) treatment.Thus, electrolysis proposes a feasible and prospective approach for waste printed circuit boards recycle

Keywords： Waste printed circuit boards (WPCBs)     Copper     Recovery rate     Purity     Electrolysis    

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A critical review on the recycling of copper and precious metals from waste printed circuit boards using

Zebing Wu, Wenyi Yuan, Jinhui Li, Xiaoyan Wang, Lili Liu, Jingwei Wang

Frontiers of Environmental Science & Engineering 2017, Volume 11, Issue 5, doi: 10.1007/s11783-017-0995-6

Abstract: In particular, waste printed circuit boards (PCBs) have become of global concern with regard to environmental

Keywords： Waste PCBs     Precious metals     Hydrometallurgy     Recycling     Leaching     Recovery    

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Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing

Yao CHEN, Jinhui LI, Huabo DUAN, Zhishi WANG

Frontiers of Environmental Science & Engineering 2011, Volume 5, Issue 2,   Pages 167-174 doi: 10.1007/s11783-011-0308-4

Abstract: and separation processes for the recovery of valuable materials, have been widely applied in waste printed

Keywords： waste printed wiring board (PWB)     residue steam     thermal-crack     mechanical properties    

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A study for printed circuit board image registeration algorithm based on AOI

Guo Fenglin,Guan Shu′an,Kong Yan

Strategic Study of CAE 2012, Volume 14, Issue 11,   Pages 103-106

Abstract:

In the printed circuit board defect inspection based on AOI, there are

Keywords： PCB defect inspection     image registration     edge points sampling     registration strength    

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Direct writing of electronics based on alloy and metal (DREAM) ink: A newly emerging area and its impact on energy, environment and health sciences

Qin ZHANG, Yi ZHENG, Jing LIU

Frontiers in Energy 2012, Volume 6, Issue 4,   Pages 311-340 doi: 10.1007/s11708-012-0214-x

Abstract: Electronics, such as printed circuit board (PCB), transistor, radio frequency identification (RFID),Conventional fabrication strategy towards integrated circuit (IC), requesting at least six working stepsThe merits and demerits between conventional printed electronics and the new direct writing methods were

Keywords： direct writing of electronics based on alloy and metal (DREAM) ink     direct writing of electronics     printedelectronics     liquid metal ink     integrated circuit     consumer electronics     nano liquid metal    

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Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths

Juan Carlos HERNANDEZ-CASTANEDA, Boon Keng LOK, Hongyu ZHENG

Frontiers of Mechanical Engineering 2020, Volume 15, Issue 2,   Pages 303-318 doi: 10.1007/s11465-019-0562-x

Abstract: This study explores the feasibility of different laser systems to sinter screen-printed lines from nonconductiveThese materials are commonly used in manufacturing functional printed electronics for large-area applications

Keywords： laser sintering     copper nanoparticles     printed electronics    

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Research on the equivalent circuit parameter　of single linear induction motor

Xu Wei,Sun Guangsheng

Strategic Study of CAE 2008, Volume 10, Issue 8,   Pages 76-80

Abstract:

The SLIM parameter has clear error to its real value on the base of the RIM parameter measurement method because it has larger air gap and edge effect. This paper proposes a new scheme suited for SLIM parameter detection. It only needs input total power, phase voltage, phase current, frequency, and then computes primary resistance, primary leakage induction, secondary resistance, secondary leakage induction, air induction and iron loss resistance. The performance analysis of SLIM indicates that this method is very effective and valuable.

Keywords： single linear induction motor     open-secondary circuit experiment     blocked-secondary circuit experiment     parameter measurement     equivalent circuit    

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Equivalent circuit and characteristic simulation of a brushless electrically excited synchronous wind

Hao WANG, Fengge ZHANG, Tao GUAN, Siyang YU

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 3,   Pages 420-426 doi: 10.1007/s11465-017-0439-9

Abstract: In view of this problem, the equivalent circuit and electromagnetic torque expression of the BEESG areThe generator is simulated and tested experimentally using the established equivalent circuit model.Results show the validity of the equivalent circuit model.

Keywords： wind power     brushless electrically excited synchronous generator     hybrid rotor     equivalent circuit    

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Printability and hardening performance of three-dimensionally-printed geopolymer based on lunar regolith

Frontiers of Structural and Civil Engineering doi: 10.1007/s11709-023-0003-0

Abstract: The results show that heating the printed filaments with a water-to-binder ratio of 0.32 at 80 °C can

Keywords： geopolymer     lunar regolith simulant     3D printing     rheology     printability    

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Design of a PCB stator coreless axial flux permanent magnet synchronous motor based on a novel topology Halbach array Regular Papers

Xiao-yuan WANG, Xiang LI, Chun-peng LI, Si-jia XU, Le-tao LING

Frontiers of Information Technology & Electronic Engineering 2019, Volume 20, Issue 3,   Pages 414-424 doi: 10.1631/FITEE.1700345

Abstract:

A novel topology Halbach permanent magnet array is proposed and applied to the design of a printedcircuit board (PCB) axial flux permanent magnet (AFPM) motor.

Keywords： Axial flux permanent magnet synchronous motor     Printed circuit board     Halbach permanent magnet array     Finite    

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Enhancement of open circuit voltage in organic solar cells by doping a fluorescent red dye

Qing LI, Junsheng YU, Yue ZANG, Nana WANG, Yadong JIANG

Frontiers in Energy 2012, Volume 6, Issue 2,   Pages 179-183 doi: 10.1007/s11708-012-0177-y

Abstract: The open circuit voltage ( ) of small-molecule organic solar cells (OSCs) could be improved by doping

Keywords： organic solar cells (OSCs)     open circuit voltage     fluorescent dye doping     4-(dicyanomethylene)-2-t-butyl    

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current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit

Zilian QU,Yonggang MENG,Qian ZHAO

Frontiers of Mechanical Engineering 2015, Volume 10, Issue 1,   Pages 1-6 doi: 10.1007/s11465-015-0325-2

Abstract: interconnects in the chemical mechanical polishing (CMP) process, which is an important step in the integrated circuitThe influence of the underneath circuit layers on the eddy current is modeled and treated as an equivalent

Keywords： CMP     eddy current     multilayer wafer     Cu interconnects     equivalent unit    

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Title Author Date Type Operation

Self-catalytic pyrolysis thermodynamics of waste printed circuit boards with co-existing metals

Journal Article

Non-toxic, high selectivity process for the extraction of precious metals from waste printed circuitboards

Journal Article

Copper fractal growth during recycling from waste printed circuit boards by slurry electrolysis

Journal Article

Copper recovery from waste printed circuit boards concentrated metal scraps by electrolysis

Xiaonan Liu, Qiuxia Tan, Yungui Li, Zhonghui Xu, Mengjun Chen

Journal Article

A critical review on the recycling of copper and precious metals from waste printed circuit boards using

Zebing Wu, Wenyi Yuan, Jinhui Li, Xiaoyan Wang, Lili Liu, Jingwei Wang

Journal Article

Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing

Yao CHEN, Jinhui LI, Huabo DUAN, Zhishi WANG

Journal Article

A study for printed circuit board image registeration algorithm based on AOI

Guo Fenglin,Guan Shu′an,Kong Yan

Journal Article

Direct writing of electronics based on alloy and metal (DREAM) ink: A newly emerging area and its impact on energy, environment and health sciences

Qin ZHANG, Yi ZHENG, Jing LIU

Journal Article

Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths

Juan Carlos HERNANDEZ-CASTANEDA, Boon Keng LOK, Hongyu ZHENG

Journal Article

Research on the equivalent circuit parameter　of single linear induction motor

Xu Wei,Sun Guangsheng

Journal Article

Equivalent circuit and characteristic simulation of a brushless electrically excited synchronous wind

Hao WANG, Fengge ZHANG, Tao GUAN, Siyang YU

Journal Article

Printability and hardening performance of three-dimensionally-printed geopolymer based on lunar regolith

Journal Article

Design of a PCB stator coreless axial flux permanent magnet synchronous motor based on a novel topology Halbach array

Xiao-yuan WANG, Xiang LI, Chun-peng LI, Si-jia XU, Le-tao LING

Journal Article

Enhancement of open circuit voltage in organic solar cells by doping a fluorescent red dye

Qing LI, Junsheng YU, Yue ZANG, Nana WANG, Yadong JIANG

Journal Article

current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit

Zilian QU,Yonggang MENG,Qian ZHAO

Journal Article